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Contact Baienwei

Address: No. 13, Baofu Road, Tianbao Industrial District, Baodi, Tianjin,China.

TEL: 86-22-29291825

FAX: 86-22-29291821

Email: alsi@baienwei.com

Website: http://www.alsi-alloys.com

Housings For Electronic Packages

Housings For Electronic Packages
We specialize in the producing of silicon aluminum(Al-Si) alloy raw materials,such as the controlled expansion Al-50%Si alloy always be chosen for housings in the electronic packages field.
Product Details

Aluminum Silicon(AlSi) alloys are binary alloys of silicon and aluminum, produced by our proprietary rapid solidification process. These controlled expansion Al-Si alloys are manufactured in a range of weight proportions of silicon and aluminum from 70Si/30Al to 27Si/73Al, with CTE’s 7 to 17 ppm/°C respectively. The specific applications of these alloys in summarized in below Table. Aside from tailoring the CTE, the key advantages these alloys over materials such as kovar and CuW are reduced weight, high stiffness and ease of manufacture.


Housing of controlled expansion Al-50%Si alloy:


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Below Table is the applications and properties of the controlled expansion Si/Al alloys:


 

Baienwei AlSi Alloys

Si content
%

 

CTE
ppm/

 

Applications

 

Main Benefits

AlSi27

27%

17

Circuit board stiffener;
heat sinks and heat spreades for telecommunication

Weight reduction;
High thermal conductivity;
Readily plating(Ni/Al)and machining
Relatively lower comparable cost with copper/Kovar

AlSi27

27%

17


PCBs carriers plates

AlSi27 alloy CTE match to PCBs;
High thermal conductivity;
Lower weight and overall cost;
Readily machining and plating

AlSi42

42%

13

Radar housings;
Laser mirror

Advanced CTE match to circuitry;
High thermal conductivity;
Ease of machining and plating(laser welded with Ni/Au)
Good hermetically;
Dimensional stability

AlSi50

50%

11

Substrates for microwave and RF circuits;
Transmit and receive modules
Microwave amplifier housings
Radar packages

Comparable higher thermal conductivity;
Lower overall cost due to dispense with Cu-Mo inserts;
Excellent Hermetically;
Manufacturability(plating and machining)

AlSi60

60%

9

Power and laser packaging

Improved CTE match to circuit board or component;
High thermal conductivity;
Dimensional stability,flatness;
Excellent laser welding process;
High specific stiffness

AlSi70

70%

7

High-power LED substrates;
Microwave carriers for telecommunications

Low CTE;
High thermal conductivity;
Lower overall cost than Cu-W

AlSi70

70%

7

Optical housings for aerospace applications
Carriers for sensor in military applications

Low CTE suit to components and stable with temperature;
High thermal conductivity;
Stiffness;
Good hermeticity;
Readily machining and plating(Au/Ti/Ni etc)


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